Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

As the next generation of semiconductor devices, SiC MOSFETs have demonstrated significant performance improvements in switching loss, switching frequency, and high-temperature operation compared to Si-based MOSFETs. However, the long-term reliability of such devices and their packaging continues to be a major concern. Towards addressing this...

Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging...

Unsupervised Feature Transfer for Batch Process Based on Geodesic Flow Kernel

The problem of misalignment of the original measurement model is caused by nonlinear, time-varying characteristic of the batch process. In this paper, a method based on geodesic flow kernel (GFK) for feature transfer is proposed. By mapping data into the manifold space, the feature transfer from source domain to target domain is implemented....

Stability Analysis of Unsaturated Soil Slope Considering the Variability of Soil-water Characteristic Curve

Soil slopes are generally unsaturated in which the soil-water characteristic curve (SWCC) plays an important role in its hydro-mechanical response. The commonly used Mohr-Coulomb failure criterion in saturated soil mechanics could be extended to take SWCC into account which is then able to determine the shear strength of unsaturated soil. Like...