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Yi, H. (author), Öztürk, E. (author), Koelink, Marco (author), Krimmling, Jana (author), Damian, Andrei A. (author), Debski, Wojciech (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Poelma, René H. (author)High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection...journal article 2022
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Zhang, B. (author), Damian, A.A. (author), Zijl, Jurrian (author), van Zeijl, H.W. (author), Zhang, Y. (author), Fan, J. (author), Zhang, Kouchi (author)There is a high demand for the implementation of metallic nanoparticle (NP) sintering technology for die attach in high-power electronics. The performance of this technology is superior to that of the technology involving the use of lead-free solders. Although Cu NP paste is potentially a low-cost material, it faces the challenge of oxidation...journal article 2021
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Zhang, B. (author), Carisey, Y.C.P. (author), Damian, A. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author)We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...conference paper 2016