Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature...

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

Board level vibration testing is intended to assess prediction of the reliability of solder joint interconnects that are formed between electronic components and printed circuit boards (PCB). Frailties in the stress test experiment might lead to false board level reliability (BLR) evaluations. Therefore, it is essential to have a well...