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Xu, Y. (author), Zhang, H. (author), Šavija, B. (author), Chaves Figueiredo, S. (author), Schlangen, E. (author)
A method is presented to model deformation and fracture behavior of 3D printed disordered lattice materials under uniaxial tensile load. A lattice model was used to predict crack pattern and load-displacement response of the printed lattice materials. To include the influence of typical layered structures of 3D printed materials in the...
journal article 2019
document
Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Jiajie (author), Placette, Mark D. (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Modern power electronics has the increased demands in current density and high-temperature reliability. However, these performance factors are limited due to the die attach materials used to affix power dies microchips to electric circuitry. Although several die attach materials and methods exist, nanosilver sintering technology has received...
journal article 2019