Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

As the next generation of semiconductor devices, SiC MOSFETs have demonstrated significant performance improvements in switching loss, switching frequency, and high-temperature operation compared to Si-based MOSFETs. However, the long-term reliability of such devices and their packaging continues to be a major concern. Towards addressing this...

Minimization of wear in a transfer chute by geometric optimization of convex pattern surface: A DEM study

Using bionic surface on the material equipment interface of bulk handling equipment is a promising solution for wear reduction. A bionic surface is a flat surface outfitted with a pattern of convexes that disrupt the natural sliding flow of bulk material. Previous numerical work has shown a significant reduction of wear of bionic surfaces...