Investigating the Parameter-Driven Cathode Gas Diffusion of PEMFCs with a Piecewise Linearization Model

Improving mass transfer in gas diffusion layers is critical to achieving high-performance proton-exchange membrane fuel cells (PEMFCs). Leaks through the interface between the gas and the membrane electrode assembly frame have been widely investigated, and the controllability of the cathode gas diffusion has not been achieved in most studies....

Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications

With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...

Research on Thermal-Mechanical Properties of GaN Power Module Based on QFN Package by Using Nano Copper/Silver Sinter Paste

The wide-bandgap semiconductors represented by GaN have a broad application prospect because of their high service temperature and high switch frequency. Quad-Flat-No-Lead (QFN) Package is currently one of the mainstream packaging methods due to its low cost and high efficiency. However, the low reliability of QFN used in GaN devices is still...

Dynamic Response of the Fluid Mud to a Tropical Storm

Fluid mud (FM) is a unique sedimentary feature in high-turbidity estuaries, where it can make a rapid contribution to morphodynamics. Insufficient field measurements and fixed-point monitoring lead to deficient understandings of the formation, transport, and breakdown of the FM under extreme weather conditions. A field survey was conducted in...