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Zeng, Simei (author), Tang, Chenggang (author), Hong, H. (author), Yuan, Fang (author), Li, Yuning (author), Wang, Yuqiang (author), Kong, Lingbing (author), Sun, Jingye (author), Zhu, Mingqiang (author), Deng, Tao (author)
The high-temperature pressure sensors have wide applications in aerospace, petroleum, geothermal exploration, automotive electronics, and other fields. However, the traditional silicon-based pressure sensors are restricted to pressure measurement under 120~{\circ }\text{C} and cannot be satisfied to measure the pressure of various gases or...
journal article 2023
document
Li, Shengli (author), Liu, Y. (author), Zhang, H. (author), Cai, Hongming (author), Sun, Fenglian (author), Zhang, Kouchi (author)
In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints were investigated. The interfacial intermetallic compound (IMC) is Cu<sub>6</sub>Sn<sub>5</sub...
journal article 2018