Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has...

Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors

With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a...