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Rong, Jian (author), Zhu, Jia-Ning (author), Xiao, Wenlong (author), Zhao, Xinqing (author), Ma, Chaoli (author)
Thermal conductivity is a key parameter for high performance material needed for electronic devices. While most commercially used Mg foundry alloys exhibit low thermal conductivities. In this work, we developed an Mg–3RE–0.5Zn alloy that is suitable for high pressure die cast (HPDC) ultrathin wall cellphone components. The thermal...
journal article 2021
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Kulczyk-Malecka, Justyna (author), Zhang, Xun (author), Carr, James (author), Nozahic, Franck (author), Estournès, Claude (author), Monceau, Daniel (author), Carabat, A.L. (author), Sloof, W.G. (author), van der Zwaag, S. (author), Withers, Philip J. (author), Xiao, Ping (author)
Yttria – partially stabilised zirconia (YPSZ) MoSi<sub>2</sub> composites have been designed to prolong the lifetime of the matrix by self – healing cracks during thermal cycling. The healing reaction at high temperatures is based on the decomposition of MoSi<sub>2</sub>, leading to a volumetrically expanding reaction product, which seals the...
journal article 2018