Fan, Jiajie (author), Jiang, Dawei (author), Zhang, Hao (author), Hu, D. (author), Liu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author) Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered nano-copper die-attachment and...
journal article 2022
