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Hou, F. (author), Wang, W. (author), Cao, Liqiang (author), Li, Jun (author), Su, Meiying (author), Lin, Tingyu (author), Zhang, Kouchi (author), Ferreira, Jan Abraham (author)
SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance...
review 2020
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Li, Yuhong (author), Su, Xiang (author), Ding, Aaron Yi (author), Lindgren, Anders (author), Liu, Xiaoli (author), Prehofer, Christian (author), Riekki, Jukka (author), Rahmani, Rahim (author), Tarkoma, Sasu (author), Hui, Pan (author)
The Internet of Things (IoT) connects smart devices to enable various intelligent services. The deployment of IoT encounters several challenges, such as difficulties in controlling and managing IoT applications and networks, problems in programming existing IoT devices, long service provisioning time, underused resources, as well as...
review 2020