Searched for: +
(1 - 11 of 11)
document
Yang, Chenyang (author), Sun, Jianwen (author), Zhang, Yulong (author), Tang, Jingya (author), Liu, Zizheng (author), Zhan, Teng (author), Wang, Dian-Bing (author), Zhang, Kouchi (author), Liu, Zewen (author), Zhang, Xian-En (author)
The COVID-19 pandemic has highlighted the need for rapid and sensitive detection of SARS-CoV-2. Here, we report an ultrasensitive SARS-CoV-2 immunosensor by integration of an AlGaN/GaN high-electron-mobility transistor (HEMT) and anti-SARS-CoV-2 spike protein antibody. The AlGaN/GaN HEMT immunosensor has demonstrated the capability to detect...
journal article 2024
document
Sun, Y. (author), Kang, Xuanwu (author), Zheng, Yingkui (author), Wei, Ke (author), Li, Pengfei (author), Wang, Wenbo (author), Liu, Xinyu (author), Zhang, Kouchi (author)
The optimization of mesa etch for a quasi-vertical gallium nitride (GaN) Schottky barrier diode (SBD) by inductively coupled plasma (ICP) etching was comprehensively investigated in this work, including selection of the etching mask, ICP power, radio frequency (RF) power, ratio of mixed gas, flow rate, and chamber pressure, etc. In particular...
journal article 2020
document
Sun, J. (author), Zhang, Shuo (author), Zhan, Teng (author), Liu, Zewen (author), Wang, Junxi (author), Yi, Xiaoyan (author), Li, Jinmin (author), Sarro, Pasqualina M (author), Zhang, Kouchi (author)
A high responsivity and controllable recovery ultraviolet (UV) photodetector based on a tungsten oxide (WO<sub>3</sub>) gate AlGaN/GaN heterostructure with an integrated micro-heater is reported for the first time. The WO<sub>3</sub>nanolayer was deposited by physical vapor deposition (PVD) for deep UV absorption and the micro-heater was...
journal article 2020
document
Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Xuejun (author), Zhang, Kouchi (author)
The nanoindentation test was conducted in this paper to investigate the indentation hardness, plasticity and initial creep properties of pressure sintered nanosilver joint at various test temperatures. The effects of strain rate on the indentation hardness were first investigated. Then yield stress of nanosilver sintered joint was studied in...
journal article 2019
document
Sun, J. (author), Zhan, Teng (author), Liu, Zewen (author), Wang, Junxi (author), Yi, Xiaoyan (author), Sarro, Pasqualina M (author), Zhang, Kouchi (author)
This paper demonstrates a method to reduce the decay time in AlGaN/GaN photodetectors by a pulsed heating mode. A suspended AlGaN/GaN heterostructure photodetector integrated with a micro-heater is fabricated and characterized under ultraviolet illumination. We have observed that the course of persistent photoconductivity was effectively...
journal article 2019
document
Sun, Y. (author), Kang, Xuanwu (author), Zheng, Yingkui (author), Lu, Jiang (author), Tian, Xiaoli (author), Wei, Ke (author), Wu, Hao (author), Wang, Wenbo (author), Liu, Xinyu (author), Zhang, Kouchi (author)
Gallium nitride (GaN)-based vertical power Schottky barrier diode (SBD) has demonstrated outstanding features in high-frequency and high-power applications. This paper reviews recent progress on GaN-based vertical power SBDs, including the following sections. First, the benchmark for GaN vertical SBDs with different substrates (Si, sapphire, and...
review 2019
document
Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Jiajie (author), Placette, Mark D. (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Modern power electronics has the increased demands in current density and high-temperature reliability. However, these performance factors are limited due to the die attach materials used to affix power dies microchips to electric circuitry. Although several die attach materials and methods exist, nanosilver sintering technology has received...
journal article 2019
document
Liu, Y. (author), Zhang, H. (author), Wang, Lingen (author), Fan, Xuejun (author), Zhang, Kouchi (author), Sun, Fenglian (author)
Purpose: Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among stress distributions, sintering sequences and sintering pressures during the sintering processes. Design/methodology/approach: Three sintering sequences, S(a)...
journal article 2019
document
Sun, J. (author), Zhan, Teng (author), Liu, Zewen (author), Wang, Junxi (author), Yi, Xiaoyan (author), Sarro, Pasqualina M (author), Zhang, Kouchi (author)
A suspended WO<sub>3</sub>-gate AlGaN/GaN heterostructure photodetector integrated with a micro-heater is micro-fabricated and characterized for ultraviolet photo detection. The transient optical characteristics of the photodetector at different temperatures are studied. The 2DEG-based photodetector shows a recovery (170 s) time under 240 nm...
journal article 2019
document
Liu, Yang (author), Zhang, H. (author), Wang, Lingen (author), Fan, Xuejun (author), Zhang, Kouchi (author), Sun, Fenglian (author)
The microstructure, thickness, porosity, and shear performance of the silver (Ag) sintering layers under different sintering pressures were investigated. Experimental results demonstrated that the thickness and the porosity of the sintering layer decreased when the sintering pressure varied from 5 MPa to 30 MPa. This densification phenomenon...
journal article 2018
document
Zhang, H. (author), Liu, Yang (author), Wang, Lingen (author), Fan, Jiajie (author), Fan, Xuejun (author), Sun, Fenglian (author), Zhang, Kouchi (author)
High reliable packaging materials are needed for electronics when they work at harsh environments. Among which, the nanosilver material has been widely studied and applied in power electronics due to its low processing temperature and high reliability. This paper investigates the bonding properties of nanosilver sintered hermetic cavity. There...
journal article 2018
Searched for: +
(1 - 11 of 11)