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Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)
As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...
conference paper 2023
document
Yalcin, A.O. (author), Fan, Z. (author), Goris, B. (author), Li, W.F. (author), Koster, R.S. (author), Fang, C.M. (author), Van Blaaderen, A. (author), Casavola, M. (author), Tichelaar, F.D. (author), Bals, S. (author), Van Tendeloo, G. (author), Vlugt, T.J.H. (author), Vanmaekelbergh, D. (author), Zandbergen, H.W. (author), Van Huis, M.A. (author)
Here, we show a novel solid?solid?vapor (SSV) growth mechanism whereby epitaxial growth of heterogeneous semiconductor nanowires takes place by evaporation-induced cation exchange. During heating of PbSe-CdSe nanodumbbells inside a transmission electron microscope (TEM), we observed that PbSe nanocrystals grew epitaxially at the expense of CdSe...
journal article 2014