Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

The Multimodal Information Based Speech Processing (Misp) 2022 Challenge: Audio-Visual Diarization And Recognition

The Multi-modal Information based Speech Processing (MISP) challenge aims to extend the application of signal processing technology in specific scenarios by promoting the research into wake-up words, speaker diarization, speech recognition, and other technologies. The MISP2022 challenge has two tracks: 1) audio-visual speaker diarization (AVSD),...

Stability Enhanced Design of EV Chargers for Weak Grid Connection

Reinforcement of the legacy grid infrastructure will be very costly and thereby unrealistic. Consequently, weak grid connection of electric vehicle (EV) chargers will sooner or later be the case. It may however bring instability issues since the EV chargers that can work well in strong grid conditions usually do not fit the weak grid...

Relative role of bed roughness, bed erosion and channel storage on peak discharge increase in hyperconcentrated floods (abstract)

The agent-construction system for procuring mega projects in China

While heated discussions have been directed towards various innovative procurement systems such as PPP, PFI, and BOT that carry the great expectation to help materialise the projects and deliver value to the society, a procurement system named agent-construction system (ACS or in Chinese Dai Jian Zhi) is being prevailing in China’s public...