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Ding, Hui (author), Egert, Sonja (author), Huang, Binxiang (author), Jiang, Tianshu (author), Carstensen, Leif (author), Šić, Edina (author), Liu, Yucheng (author), Yang, Tongqing (author), Braga Groszewicz, P. (author)High-resolution scanning transmission electron microscopy (STEM) enjoys great advantages for atomic-resolution visualization of the atomic structure, while failing to disclose structural information along the atomic columns. On the other hand, solid-state nuclear magnetic resonance (NMR) spectroscopy is highly sensitive to the three...journal article 2023
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Chen, Jiaqi (author), Dan, Hancheng (author), Ding, Yongjie (author), Gao, Y. (author), Guo, Meng (author), Guo, Shuaicheng (author), Han, Bingye (author), Hong, Bin (author), Hou, Yue (author), Hu, Chichun (author), Hu, Jing (author), Huyan, Ju (author), Jiang, Jiwang (author), Jiang, Wei (author), Li, Cheng (author), Liu, Pengfei (author), Liu, Yu (author), Liu, Zhuangzhuang (author), Lu, Guoyang (author), Ouyang, Jian (author), Qu, Xin (author), Ren, Dongya (author), Wang, Chao (author), Wang, Chaohui (author), Wang, Dawei (author), Wang, Di (author), Wang, Hainian (author), Wang, Haopeng (author), Xiao, Yue (author), Xing, Chao (author), Xu, Huining (author), Yan, Yu (author), Yang, Xu (author), You, Lingyun (author), You, Zhanping (author), Yu, Bin (author), Yu, Huayang (author), Yu, Huanan (author), Zhang, Henglong (author), Zhang, Jizhe (author), Zhou, Changhong (author), Zhou, Changjun (author), Zhu, Xingyi (author)Sustainable and resilient pavement infrastructure is critical for current economic and environmental challenges. In the past 10 years, the pavement infrastructure strongly supports the rapid development of the global social economy. New theories, new methods, new technologies and new materials related to pavement engineering are emerging....review 2021
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Ding, Chao (author), Wang, Jian (author), Liu, Tianhan (author), Qin, Hongbo (author), Yang, Daoguo (author), Zhang, Kouchi (author)Full intermetallic compound (IMC) solder joints present fascinating advantages in high-temperature applications. In this study, the mechanical properties and elastic anisotropy of η’-Cu6Sn5 and Cu3Sn intermetallic compounds were investigated using first-principles calculations. The values of single-crystal elastic constants, the elastic (E),...journal article 2021
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Ding, Ran (author), Liu, Geng (author), Wan, Xinhao (author), Ponge, Dirk (author), Raabe, Dierk (author), Godfrey, Andy (author), Furuhara, Tadashi (author), Yang, Zhigang (author), van der Zwaag, S. (author)For decades, grain boundary engineering has proven to be one of the most effective approaches for tailoring the mechanical properties of metallic materials, although there are limits to the fineness and types of microstructures achievable, due to the rapid increase in grain size once being exposed to thermal loads (low thermal stability of...journal article 2020