Reliability at the Chip Interfaces: Delaminating the Silicon Die from Molding Compound

This book describes a setup that allows to delaminate the Silicon-to-Molding Compound interface for obtaining interfacial fracture parameters: the Mixed Mode Chisel setup (MMC). With this device for the first time the delamination can be initiated and propagated, while preventing the occurrence of random brittle fracture in one or both of the...