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Damian, Mircea (author), Shyrokau, B. (author), Carrera Akutain, Xabier (author), Happee, R. (author)A realistic steering feel is one of the key elements to guarantee fidelity on a driving simulator in general, and in particular to replicate on-centre vehicle handling. This requires precise modelling of the steering dynamics, a high bandwidth control loading system, and coupling of virtual and physical components in agreement with...journal article 2022
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Yi, H. (author), Öztürk, E. (author), Koelink, Marco (author), Krimmling, Jana (author), Damian, Andrei A. (author), Debski, Wojciech (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Poelma, René H. (author)High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection...journal article 2022
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Zhang, B. (author), Damian, A.A. (author), Zijl, Jurrian (author), van Zeijl, H.W. (author), Zhang, Y. (author), Fan, J. (author), Zhang, Kouchi (author)There is a high demand for the implementation of metallic nanoparticle (NP) sintering technology for die attach in high-power electronics. The performance of this technology is superior to that of the technology involving the use of lead-free solders. Although Cu NP paste is potentially a low-cost material, it faces the challenge of oxidation...journal article 2021
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Zhang, B. (author), Carisey, Y.C.P. (author), Damian, A. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author)We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...conference paper 2016
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Raepsaet, X. (author), Damian, F. (author), Ohlig, U.A. (author), Brockmann, H.J. (author), de Haas, J.B.M. (author), Wallerbos, EM (author)In the frame of the European contract HTR-N, a work package is devoted to the code validation and method improvements as far as the high temperature gas-cooled reactor (HTGR) core modelling is concerned. Institutions from three countries are involved in this work package: FZJ in Germany, NRG and IRI in the Netherlands, and CEA in France. The...journal article 2003