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Liang, M. (author), He, S. (author), Gan, Yidong (author), Zhang, Hongzhi (author), Chang, Z. (author), Schlangen, E. (author), Šavija, B. (author)This paper employs computer vision techniques to predict the micromechanical properties (i.e., elastic modulus and hardness) of cement paste based on an input of Backscattered Electron (BSE) images. A dataset comprising 40,000 nanoindentation tests and 40,000 BSE micrographs was built by express nanoindentation test and Scanning Electron...journal article 2023
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Li, Shengli (author), Liu, Y. (author), Zhang, H. (author), Cai, Hongming (author), Sun, Fenglian (author), Zhang, Kouchi (author)In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints were investigated. The interfacial intermetallic compound (IMC) is Cu<sub>6</sub>Sn<sub>5</sub...journal article 2018