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Chen, Jiaqi (author), Dan, Hancheng (author), Ding, Yongjie (author), Gao, Y. (author), Guo, Meng (author), Guo, Shuaicheng (author), Han, Bingye (author), Hong, Bin (author), Hou, Yue (author), Hu, Chichun (author), Hu, Jing (author), Huyan, Ju (author), Jiang, Jiwang (author), Jiang, Wei (author), Li, Cheng (author), Liu, Pengfei (author), Liu, Yu (author), Liu, Zhuangzhuang (author), Lu, Guoyang (author), Ouyang, Jian (author), Qu, Xin (author), Ren, Dongya (author), Wang, Chao (author), Wang, Chaohui (author), Wang, Dawei (author), Wang, Di (author), Wang, Hainian (author), Wang, Haopeng (author), Xiao, Yue (author), Xing, Chao (author), Xu, Huining (author), Yan, Yu (author), Yang, Xu (author), You, Lingyun (author), You, Zhanping (author), Yu, Bin (author), Yu, Huayang (author), Yu, Huanan (author), Zhang, Henglong (author), Zhang, Jizhe (author), Zhou, Changhong (author), Zhou, Changjun (author), Zhu, Xingyi (author)Sustainable and resilient pavement infrastructure is critical for current economic and environmental challenges. In the past 10 years, the pavement infrastructure strongly supports the rapid development of the global social economy. New theories, new methods, new technologies and new materials related to pavement engineering are emerging....review 2021
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Zhang, Y. (author), Wang, Xuancang (author), Ji, Guanyu (author), Fan, Zhenyang (author), Guo, Yuchen (author), Gao, Wenze (author), Xin, Lei (author)Lignin, as a bio-based waste, has been utilized in the asphalt industry due to various advantages. This study aimed to investigate the effects of two lignin products (lignin powder and lignin fiber) on the mechanical properties of asphalt mixtures. The raveling, rutting, thermal and fatigue cracking resistance, and moisture susceptibility of...journal article 2020
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Gao, Hanyan (author), Zhang, Jing (author), Zhu, Yingcan (author), Guo, Ruiqian (author), Zhang, Wanlu (author), Zhang, Kouchi (author), Liu, Pan (author)With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation...conference paper 2022