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Cai, Miao (author), Cui, Peng (author), Qin, Yikang (author), Geng, Daoshuang (author), Wei, Qiqin (author), Wang, Xiyou (author), Yang, Daoguo (author), Zhang, Kouchi (author)
Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the...
review 2020
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Yao, Dengzhi (author), Wang, Ju (author), Cai, Yao (author), Zhao, Tingting (author), An, Xizhong (author), Zhang, Hao (author), Fu, Haitao (author), Yang, Xiaohong (author), Zou, Qingchuan (author), Wang, L. (author)
Understanding and controlling the composition segregation during powder spreading is of key importance in the additive manufacturing (AM) of composite materials. Under this circumstance, the segregation behavior of WC/316 L composite powders during spreading in laser powder bed fusion (LPBF) AM was numerically investigated by the discrete...
journal article 2022
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Qian, Cheng (author), Gu, Tijian (author), Wang, Ping (author), Cai, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Sintered nano-silver die-attach materials have been widely used in high-power electronics packaging because of their high thermal and electrical conductivities. In this study, we characterized the tensile properties of sintered nano-silver particles over a range of strain rates and temperatures, and established the constitutive models. First, 50...
journal article 2022