Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has...

Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...

Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition

As a core packaging material of light color conversion, phosphor/silicone composite plays an indispensable role in light emitting diode (LED) packaging. At present, commercial LED packages mainly use blue LED chips to stimulate Yttrium Aluminum Garnet (YAG) yellow phosphor to reach a white color. However, (Ca,Sr)AlSiN 3 :Eu 2+ (CSASN) red...

Using Mixed Incentives to Document Xi’an Guanzhong

This paper describes our use of mixed incentives and the citizen science portal LanguageARC to prepare, collect and quality control a large corpus of object namings for the purpose of providing speech data to document the under-represented Guanzhong dialect of Chinese spoken in the Shaanxi province in the environs of Xi’an.

Research on preparation and properties of C-S-H /PEG1000 phase change composite

In this paper, composite material C-S-H/PEG1000 was prepared by multi-scale porous material C-S-H as support and phase change material (PCM) PEG1000 by melt blending, so that it can reduce hydration heat of cementitious system utilizing the characteristics of releasing and storing energy of PCM. TEM, IR, DSC-Tg, BET, MIP and various other...

AlGaN/GaN HEMT micro-sensor technology for gas sensing applications

Wide bandgap gallium nitride material has highly favorable electronic properties for next generation power and high frequency electronic devices. A less widely studied application is highly miniaturized chemical and gas sensors capable of operating in harsh environment conditions. In this work we present our recent developments on design,...