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document
Akgün, O.C. (author), Nanbakhsh, K. (author), Giagka, Vasiliki (author), Serdijn, W.A. (author)
One key obstacle in employing silicon integrated circuits in flexible implants is ensuring a long-term operation of the chip within the wet corrosive environment of the body. For this reason, throughout the years, various biocompatible insulating materials have been proposed, yet, evaluating their long-term encapsulation performance on...
conference paper 2019
document
Akgün, O.C. (author), Nanbakhsh, K. (author), Giagka, Vasiliki (author), Serdijn, W.A. (author)
For mm-sized implants incorporating silicon integrated circuits, ensuring lifetime operation of the chip within the corrosive environment of the body still remains a critical challenge. For the chip's packaging, various polymeric and thin ceramic coatings have been reported, demonstrating high biocompatibility and barrier properties. Yet, for...
journal article 2020