Integrated Silicon-Polymer Laterally Stacked Bender for Sensing Microgrippers

Nano-hole arrays in thin Au/Pd film on glass, for high speed molecular analysis

MEMS enabled fast time-resolved X-ray diffraction characterization platform for copper nanoparticle sintering in heterogeneous integration applications

We report the design, fabrication and experimental investigation of a MEMS micro-hotplate (MHP) for fast time-resolved X-ray diffraction (TRXRD) study of Cu nanoparticle paste (nanoCu paste) sintering process. The device and its system are designed to have a 60 ms minimum time interval, uniform temperature distribution and variant gas...

Pattern transfer on a vertical cavity sidewall using SU8

In this paper, a process to realize metal lines on the sidewall of high aspect ratio cavities is developed. As an alternative to conventional photoresist, SU8 is used to define patterns on vertical sidewalls of deep cavities while maintaining compatibility with conventional IC processes. When transferring a pattern onto a 3D structure,...

Single-Mask Fabrication of Temperature Triggered MEMS Switch for Cooling Control in SSL System

A micro-electro-mechanical-system (MEMS) based, temperature triggered, switch is developed as a cost-effective solution for smart cooling control of solid-state-lighting systems. The switch (1.0x0.4 mm2) is embedded in a silicon substrate and fabricated with a single-mask 3D micro-machining process. The device switches on at a designed...

From 2-Dimensional Lithography To 3-Dimensional Structures

Lithography for IC device fabrication is a high volume high accuracy production technology. Such production characteristics are also attractive for MEMS and 3 dimensional (3D) integration processes. However, advanced lithography has a strong 2 dimensional (2D) nature and is not optimized to fabricate 3D structures. In this work, 5 exposure and...

From 2D Lithography to 3D Patterning

Lithography as developed for IC device fabrication is a high volume high accuracy patterning technology with strong 2 dimensional (2D) characteristics. This 2D nature makes it a challenge to integrate this technology in a 3 dimensional (3D) manufacturing environment. This article addresses the performance of a waferstepper (ASML PAS5000) in...

A silicon MEMS structure for characterization of femto-farad-level capacitive sensors with lock-in architecture

This paper presents a silicon MEMS capacitive structure to investigate a test methodology for fF-level capacitive sensors’ measurement. The device mimics a capacitive sensor with a changing intermediate layer between the electrodes. A single mask bulk micromachining process is used to fabricate the device, which has a nominal capacitance of 1.2...

6 DOF Force and Torque Sensor for Micro-manipulation Applications

This paper presents the design, fabrication and characterization of a piezoresistive 6 Degrees of Freedom (DOF) force and torque sensor to be used in micro-manipulation. The mechanical structure of the device consists of 7 suspended beams and a calibration structure, which can be replaced by micro-manipulation tools such as micro-grippers or...

Suspended Submicron Silicon-Beam for High Sensitivity Piezoresistive Sensing

This paper presents a submicron suspended piezoresistive silicon-beam structure as a basic sensing element to replace the conventional piezoresistors, so to improve the detection sensitivity. The alternative element benefits from the increase of the induced stress, which is locally concentrated on the suspended submicron beam. This approach...

Correction: Study on the controllability of the fabrication of single-crystal silicon nanopores/nanoslits with a fast-stop ionic current-monitored TSWE method (Microsystems & Nanoengineering, (2023), 9, 1, (63), 10.1038/s41378-023-00532-0)

Correction to: Microsystems & Nanoengineering published online 16 May 2023 Correction Following publication of the original article¹, it was noticed that the phrase ‘DNA sequencing’ is incorrect, which should be replaced by ‘biosensing’. The original paper has been updated.

Stretchable Binary Fresnel Lens for Focus Tuning

This paper presents a tuneable binary amplitude Fresnel lens produced by wafer-level microfabrication. The Fresnel lens is fabricated by encapsulating lithographically defined vertically aligned carbon nanotube (CNT) bundles inside a polydimethyl-siloxane (PDMS) layer. The composite lens material combines the excellent optical absorption...

Study on the controllability of the fabrication of single-crystal silicon nanopores/nanoslits with a fast-stop ionic current-monitored TSWE method

The application of single-crystal silicon (SCS) nanopore structures in single-molecule-based analytical devices is an emerging approach for the separation and analysis of nanoparticles. The key challenge is to fabricate individual SCS nanopores with precise sizes in a controllable and reproducible way. This paper introduces a fast-stop ionic...