Secure Logistic Regression for Vertical Federated Learning

Data island effectively blocks the practical application of machine learning. To meet this challenge, a new framework known as federated learning was created. It allows model training on a large amount of scattered data owned by different data providers. This article presents a parallel solution for computing logistic regression based on...

Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films

The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...

Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration

Copper nanoparticles (CuNPs) sintering for flip-chip interconnects is a promising solution for 3D and heterogeneous integration to overcome the limitation of solder materials. To this end, we perform the photolithographic stencil printing method to pattern CuNPs, and the form of flip-chip interconnects is completed after CuNPs sintering...

The Multimodal Information Based Speech Processing (Misp) 2022 Challenge: Audio-Visual Diarization And Recognition

The Multi-modal Information based Speech Processing (MISP) challenge aims to extend the application of signal processing technology in specific scenarios by promoting the research into wake-up words, speaker diarization, speech recognition, and other technologies. The MISP2022 challenge has two tracks: 1) audio-visual speaker diarization (AVSD),...