Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Pore structure of blended cement paste by means of pressurization¿depressurization cycling mercury intrusion porosimetry

Concrete containing supplementary cementitious materials (SCMs) has different durability properties from that containing pure Portland cement. The durability of concrete is always associated with the properties of microstructure, especially pore structure. Pressurization–Depressurization Cycling Mercury Intrusion Porosimetry (PDC-MIP) was...