A Buried Vertical Filter for Micro and Nanoparticle Filtration

This paper presents a silicon micromachined filter for micro- and nanoparticles. The filter is vertical and completely buried beneath the surface. The buried aspect allows additional features to be integrated above the filter, while the vertical aspect allows the creation of highly uniform pores and efficient use of die area. The filter is...

From 2-Dimensional Lithography To 3-Dimensional Structures

Lithography for IC device fabrication is a high volume high accuracy production technology. Such production characteristics are also attractive for MEMS and 3 dimensional (3D) integration processes. However, advanced lithography has a strong 2 dimensional (2D) nature and is not optimized to fabricate 3D structures. In this work, 5 exposure and...

From 2D Lithography to 3D Patterning

Lithography as developed for IC device fabrication is a high volume high accuracy patterning technology with strong 2 dimensional (2D) characteristics. This 2D nature makes it a challenge to integrate this technology in a 3 dimensional (3D) manufacturing environment. This article addresses the performance of a waferstepper (ASML PAS5000) in...

Influence of seed layer on crystallinity and orientation of pulsed — DC sputtered AlN thin-films for piezoelectric actuators

Aluminum Nitride thin films with the desired properties for piezoelectric actuators are grown by pulsed DC sputtering on Si (100) substrates coated with different seed layers (Al/1%Si, Mo, Ti). The influence of sputtering parameters and the seed layers on crystallinity and orientation of the AlN films is investigated. Raman spectroscopy...