Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

FedKNOW: Federated Continual Learning with Signature Task Knowledge Integration at Edge

Deep Neural Networks (DNNs) have been ubiquitously adopted in internet of things and are becoming an integral of our daily life. When tackling the evolving learning tasks in real world, such as classifying different types of objects, DNNs face the challenge to continually retrain themselves according to the tasks on different edge devices....

Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications

With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost...

Machine learning assisted early anomaly detection of LEDs with spectral power distribution modeling

Spectral power distribution (SPD) is the radiation power intensity at different wavelengths, containing the most basic photometric and colorimetric performance of the illuminant, which is able to predict the lifetime of LEDs. This paper proposes an SPD model assisted by machine learning algorithms to detect the early failure of white LEDs. The...

EdgeVisionBench: A Benchmark of Evolving Input Domains for Vision Applications at Edge

Vision applications powered by deep neural networks (DNNs) are widely deployed on edge devices and solve the learning tasks of incoming data streams whose class label and input feature continuously evolve, known as domain shift. Despite its prominent presence in real-world edge scenarios, existing benchmarks used by domain adaptation methods...

Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...

Investigation on Transient Failure Mode of Asymmetric Trench Gate SiC MOSFET Under Single-Pulse Avalanche Stress

In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...

Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications

With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...

High-Voltage and High-Current IGBT Press-pack Module for Power Grid

On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to solve the problem of chips failure caused by non-uniform rigid...

Microwave heating simulation of asphalt pavements

Microwave heating is a promising heating technology for the maintenance, recycling and deicing of pavement structures. Many experimental studies have been conducted to investigate the microwave heating properties of asphalt mixtures in the laboratory. However, very few studies investigated the application of microwave heating on asphalt...

Oxidation simulation of thin bitumen film

Oxidative aging is a complex phenomenon in bitumen and its fundamental understanding is needed to optimize paving materials with long-lasting characteristics. This research reports on a diffuse-reaction model for predicting the oxidation of bituminous binders over time and under different conditions. As known, the oxidation of bitumen is...

Dissolution simulation of polymers in bitumen

Fundamental models should be developed and utilized in order to facilitate the chemo-mechanical design of modified binder systems for paving applications but not only. Especially, the fact that the incorporation of new chemical substances used as bio-based modifiers or alternative binders is attracting great interest to replace traditional...

Investigation on the DC CB Performance during a Current Interruption Failure at First Current Zero

The vacuum interrupter is used as the key component of an active DCCB due to its excellent interruption and dielectric recovery characteristics after current zero. The vacuum interrupter can only interrupt the fault currents below the limitation of a critical di/dt and TIV, otherwise it causes a reignition and the interruption failure. In...

Metagenomic insights into the bio-functionality of 21 anaerobic biogas reactors (abstract)