A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques

The growing trend of the Internet of Things (IoT) involves trillions of sensors in various applications. An extensive array of parameters need to be gathered concurrently with high-precision, low-cost, and low-power sensor nodes, such as resistive (R) and capacitive (C) sensors. Single-chip channel fusion can be an effective solution, while...

High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of...

Reviving the rock-salt phases in Ni-rich layered cathodes by mechano-electrochemistry in all-solid-state batteries

The rock-salt phase (RSP) formed on the surface of Ni-rich layered cathodes in liquid-electrolyte lithium-ion batteries is conceived to be electrochemically "dead". Here we show massive RSP forms in the interior of LiNi_xMn_yCo_(1−x-y)O₂ (NMC) crystals in sulfide based all solid state batteries (ASSBs)...

A Crystal-Less Clock Generation Technique for Battery-Free Wireless Systems

The size of wireless systems is required to be reduced in many applications, such as ultra-low-power sensor nodes and wearable/implantable devices, where battery and crystal are the two main bottlenecks in system miniaturization. In recent years, battery-free radios based on wireless power transfer (WPT) have shown great potential in...

A 2m-Range 711uW Body Channel Communication Transceiver Featuring Dynamically-Sampling Bias-Free Interface Front End

Body Channel Communication (BCC) offers a low-loss signal transmission medium for ultra-low-power wearable devices on human body [1]. However, the effective communication range on human body is limited to less than 1m in the state-of-the-art BCC transceivers [2], where the signal loss at the interface of body surface and BCC receiver remains to...

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile...