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Wang, S. (author), Tan, Yanlong (author), Liu, Xu (author), Li, Shizhen (author), Liu, Ke (author), Yuan, Wucheng (author), Li, Tao (author), Zhang, Kouchi (author), French, P.J. (author), Ye, Huaiyu (author), Tan, Chunjian (author)
In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...
conference paper 2023
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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)
The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...
conference paper 2024
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Li, Wenyu (author), Chen, Wei (author), Jiang, Jing (author), Wang, Wenbo (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)
Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has...
conference paper 2024
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Li, J. (author), Vollebregt, S. (author), Zhang, Y. (author), Shekhar, A. (author), May, Alexander (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Due to the deficient passivation of the interface between silicon carbide and silicon dioxide, the defect-induced capture and release of trapped charges triggered by external Bias Temperature Stress (BTS) leads to parameter shifts and degraded device performance. This study models the trap-induced transient current in silicon carbide metal-oxide...
conference paper 2024
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Hu, D. (author), Wang, Chieh (author), Li, Z. (author), Gupta, N. (author), Poelma, René H. (author), Shi, Ziliang (author), Fan, J. (author), Zhang, Kouchi (author)
Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...
conference paper 2024
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Gaunaa, Mac (author), Li, Ang (author), McWilliam, Michael (author), Kelly, Mark (author)
conference paper 2024
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Wang, L. (author), Unsiwilai, S. (author), Zeng, Y. (author), Shen, C. (author), Hendriks, J.M. (author), Moraal, J. (author), Zoeteman, A. (author), Nunez, Alfredo (author), Dollevoet, R.P.B.J. (author), Li, Z. (author)
Railway transition zones connecting conventional embankments and rigid struc-tures, such as bridges and tunnels, usually degrade much faster than other railway sections. Efficient health condition monitoring of transition zones is important for preventative track maintenance. In this paper, a methodology for monitoring rail-way transition zones...
conference paper 2024
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Li, C. (author), Hendriks, R.C. (author)
Estimating the parameters that describe the acoustic scene is very important for many microphone array applications. For example, consider the power spectral densities (PSDs) or relative acoustic transfer functions (RTFs) that are required when estimating a particular sound source using multi-microphone noise reduction. State-of-the-art...
conference paper 2023
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Li, H. (author), Rieger, Phillip (author), Zeitouni, Shaza (author), Picek, S. (author), Sadeghi, Ahmad Reza (author)
Federated Learning (FL) has become very popular since it enables clients to train a joint model collaboratively without sharing their private data. However, FL has been shown to be susceptible to backdoor and inference attacks. While in the former, the adversary injects manipulated updates into the aggregation process; the latter leverages...
conference paper 2023
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Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...
conference paper 2024
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Zhang, Li (author), Luo, Bixiong (author), Peng, Kaijun (author), Ren, Zongdong (author), Li, Xiaoyu (author), Zhu, Xiangdong (author), Duan, Dexuan (author), Liu, Haiyang (author), Cai, Yanfeng (author)
conference paper 2024
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