Searched for: +
(41 - 60 of 103)

Pages

document
Zhong, N. (author)
Thermal interface materials (TIMs) are widely used as gap–filler materials between electronic devices such as LEDs and ICs and their heat sink and aim to control the heat dissipation and to provide mechanical anchoring. As the rated power densities of electronic devices are increasing rapidly, the TIMS are exposed to higher thermal and...
doctoral thesis 2020
document
Iannarelli, A. (author), Ghaffarian Niasar, M. (author), Ross, Robert (author)
Dielectric elastomer actuators (DEAs) are a class of electrostatic actuators that have promising applications in fields like sensors, soft-robotics, microfluidics, and energy harvesting. The crucial points in the working principle of DEA are the application of high electric field and the use of compliant electrodes. These electrodes are...
journal article 2020
document
Stambaugh, K.A. (author)
Ships must perform their missions with a high degree of reliability to maximize availability through their service life. The ultimate safety of the hull structure is time-dependent with degradation caused by the operational environment. Achieving the fore mentioned reliability and mission availability requirements are complicated because ships...
doctoral thesis 2020
document
Bosio, A. (author), O'Connor, I. (author), Rodrigues, G. S. (author), Lima, F. K. (author), Hamdioui, S. (author)
Today's computer architectures and semiconductor technologies are facing major challenges making them incapable to deliver the required features (such as computer efficiency) for emerging applications. Alternative architectures are being under investigation in order to continue deliver sustainable benefits for the foreseeable future society...
conference paper 2020
document
Copetti, Thiago (author), Cardoso Medeiros, G. (author), Taouil, M. (author), Hamdioui, S. (author), Poehls, Leticia Bolzani (author), Balen, Tiago (author)
Fin Field-Effect Transistor (FinFET) technology enables the continuous downscaling of Integrated Circuits (ICs), using the Complementary Metal-Oxide Semiconductor (CMOS) technology in accordance with the More Moore domain. Despite demonstrating improvements on short channel effect and overcoming the growing leakage problem of planar CMOS...
conference paper 2020
document
Cai, Miao (author), Cui, Peng (author), Qin, Yikang (author), Geng, Daoshuang (author), Wei, Qiqin (author), Wang, Xiyou (author), Yang, Daoguo (author), Zhang, Kouchi (author)
Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the...
review 2020
document
Teixeira, Rui (author), Nogal Macho, M. (author), O'Connor, Alan (author), Martinez-Pastor, Beatriz (author)
Reliability assessment with adaptive Kriging has gained notoriety due to the Kriging capability of accurately replacing the performance function while performing as a self-improving function for learning procedures. Recent works on adaptive Kriging pursued to improve the efficiency of the active learning through the application of distinct...
journal article 2020
document
Bakker, N.J. (author), Rasia, Alix (author), Assen, Suzanne (author), Aflouat, Basma Ben Said (author), Weeber, A.W. (author), Theelen, Mirjam (author)
When a PV module is partially shaded, the shaded solar cells operate in a reverse bias condition. For Cu(In,Ga)Se2 cells this condition can cause defects that irreversibly reduce the output of these cells and the full module. In order to design robust shade-tolerant CIGS modules details need to be known of the conditions at which these...
journal article 2020
document
Fan, J. (author), Wu, Jie (author), Jiang, Changzhen (author), Zhang, H. (author), Ibrahim, M.S. (author), Deng, Liang (author)
To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and...
journal article 2020
document
Wiegmans, B. (author), Witte, Patrick (author), Janic, M. (author), de Jong, Tom (author)
This paper examines the use of big data and data analytics in international transport networks from the perspective of historical big data, focusing on shipping logs from the British, Dutch, Spanish and French fleets in between 1662 and 1855. Based on a large-scale database containing mainly meteorological data collected in the CLIWOC project...
journal article 2020
document
Pang, Menglin (author), Tiberius, C.C.J.M. (author)
This paper presents an approach to analyse the quality, in terms of precision and reliability, of a system which integrates-at the observation-level-landmark positions and GNSS measurements, obtained with a single camera and a digital map, and a single frequency GNSS receiver respectively. We illustrate the analysis by means of design...
journal article 2020
document
Haberfehlner, Helga (author), Goudriaan, Marije (author), Bonouvrié, Laura A. (author), Jansma, Elise P. (author), Harlaar, J. (author), Vermeulen, R. Jeroen (author), Van Der Krogt, Marjolein M. (author), Buizer, Annemieke I. (author)
Background: In this systematic review we investigate which instrumented measurements are available to assess motor impairments, related activity limitations and participation restrictions in children and young adults with dyskinetic cerebral palsy. We aim to classify these instrumented measurements using the categories of the international...
review 2020
document
Seyffert, Harleigh C. (author), Kana, A.A. (author)
Evaluating marine system reliability requires considering the interaction of a limit state with the stochastic ocean excitation. Given a range of operational profiles, a relevant question is which sea states lead to the worst-case system responses, considering the effects of short and long-term variability. If the identified subset of...
journal article 2020
document
Jiang, Y. (author), Cucu Laurenciu, N. (author), Wang, H. (author), Cotofana, S.D. (author)
As CMOS scaling is reaching its limits, high power density and leakage, low reliability, and increasing IC production costs are prompting for developing new materials, devices, architectures, and computation paradigms. Additionally, temperature variations have a significant impact on devices and circuits reliability and performance. Graphene...
conference paper 2020
document
Peyghami, S. (author), Blaabjerg, Frede (author), Rueda, José L. (author), Palensky, P. (author)
Power electronic converters are one of failure sources in energy systems, and hence drivers of downtime costs in power systems. Different approaches can be employed for converter reliability enhancement including design/control for reliability methods, condition monitoring and fault diagnosis, and maintenance strategies. This paper proposes...
conference paper 2020
document
Mamone, Dario (author), Bosio, Alberto (author), Savino, Alessandro (author), Hamdioui, S. (author), Rebaudengo, Maurizio (author)
Nowadays, the reliability has become one of the main issues for safety-critical embedded systems, like automotive, aerospace and avionic. In an embedded system, the full system stack usually includes, between the hardware layer and the software/application layer, a middle layer composed by the Operating System (OS) and the middleware. Most of...
conference paper 2020
document
Wei, C. (author), Hendriks, Koen V. (author), van Riemsdijk, M.B. (author), Jonker, C.M. (author)
Agents in teamwork may be highly interdependent on each other, the awareness of interdependence relationships is an important requirement for designing and consequently implementing a multi-agent system. In this work, we propose a formal graphical and domain-independent language that can facilitate the identification of comprehensive...
journal article 2019
document
Nazarian, G. (author)
Microprocessors are used in an expanding range of applications from small embedded system devices to supercomputers and mainframes. Moreover, embedded microprocessor based systems became essential in modern societies. Depending on the application domain, embedded systems have to satisfy different constraints. The major challenges today are cost,...
doctoral thesis 2019
document
Nogal Macho, M. (author), Morales Napoles, O. (author), O'Connor, A. (author)
The concept of intrinsic vulnerability of a traffic network is defined for the first time in this paper. Intrinsic vulnerability is the susceptibility to incidents characterised by a probability of occurrence in space and time of difficult estimation, which can result in considerable reduction or loss of the system functionality. Given the...
journal article 2019
document
Baladeh, Aliakbar Eslami (author), Khakzad, N. (author)
Complex networks play a vital role in reliability analysis of real-world applications, demanding for precise and accurate analysis methods for optimal allocations of cost and reliability. Since the configuration of a system may change with every feasible solution of cost allocation optimization equation, finding the best arrangement of the...
conference paper 2019
Searched for: +
(41 - 60 of 103)

Pages