- Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling
- Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
- A bi-level framework for heterogeneous fleet sizing of ride-hailing services considering an approximated mixed equilibrium between automated and non-automated traffic
- Effects of natural and thermal oxidation on electronic and optical properties of monolayer WS2: a theoretical study
- Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
- Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
- Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation
- Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging
- Naturally effective inhibition of microbial corrosion on carbon steel by beneficial biofilm in the South China Sea
- Revealing The Degradation Mechanism of (Sr,Ca)AlSiN3:Eu2+ Phosphor Aged Under Thermal-Moisture-Sulfur Conditions: A Combined Experimental and Ab Initio Study
- HAS-RL: A Hierarchical Approximate Scheme Optimized With Reinforcement Learning for NoC-Based NN Accelerators
- In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks
- A Q-learning based multi-strategy integrated artificial bee colony algorithm with application in unmanned vehicle path planning
- Optimal Design of 100–2000 V 4H–SiC Power MOSFETs using Multi-objective Particle Swarm Optimization Algorithms
- Optimizing the chemical vapor deposition process of 4H–SiC epitaxial layer growth with machine-learning-assisted multiphysics simulations
- Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures