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Guerra, Victor (author), Hamon, Benoit (author), Bataillou, Benoit (author), Inamdar, A.S. (author), van Driel, W.D. (author)This paper introduces an ontology-based Digital Twin (DT) architecture for the lighting industry, integrating simulation models, data analytics, and visualization to represent luminaires. The ontology standardizes luminaire components, facilitating interoperability with design tools. The calculated ontology-level metrics suggest mid-level...journal article 2024
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Martin, H.A. (author), Smits, Edsger C.P. (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)This article introduces an online condition monitoring strategy that utilizes a transient heat pulse to detect package thermal performance degradation. The metric employed is the temperature-dependent transient thermal impedance "Zth(t, Tamb)."The proposed methodology offers quantitative insights into package thermal performance degradation...journal article 2024
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Bordin, A. (author), Li, Xiang (author), van Driel, D. (author), Wolff, J.C. (author), Wang, Q. (author), ten Haaf, S.L.D. (author), Wang, Guanzhong (author), van Loo, N. (author), Kouwenhoven, Leo P. (author), Dvir, T. (author)The formation of a topological superconducting phase in a quantum-dot-based Kitaev chain requires nearest neighbor crossed Andreev reflection and elastic cotunneling. Here, we report on a hybrid InSb nanowire in a three-site Kitaev chain geometry - the smallest system with well-defined bulk and edge - where two superconductor-semiconductor...journal article 2024
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Rocchetta, Roberto (author), Zhan, Zhouzhao (author), van Driel, W.D. (author), Di Bucchianico, Alessandro (author)Lifetime analyses are crucial for ensuring the durability of new Light-emitting Diodes (LEDs) and uncertainty quantification (UQ) is necessary to quantify a lack of usable failure and degradation data. This work presents a new framework for predicting the lifetime of LEDs in terms of lumen maintenance, effectively quantifying the natural...journal article 2024
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van Driel, D. (author), Roovers, B. (author), Zatelli, F. (author), Bordin, A. (author), Wang, Guanzhong (author), van Loo, N. (author), Wolff, J.C. (author), Mazur, G.P. (author), Kouwenhoven, Leo P. (author), Dvir, T. (author)The proximity effect of superconductivity on confined states in semiconductors gives rise to various bound states such as Andreev bound states, Andreev molecules, and Majorana zero modes. While such bound states do not conserve charge, their fermion parity is a good quantum number. One way to measure parity is to convert it to charge first,...journal article 2024
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Myland, Paul (author), Herzog, Alexander (author), Babilon, Sebastian (author), van Driel, W.D. (author), Khanh, Tran Quoc (author)This study explores a novel approach to monitor the spectral emission of LEDs by estimating the spectral power distribution from the spectral sensor responses during an accelerated aging experiment. Two methods for reconstructing the actual LED spectra from sensor responses are presented and tested, one solely requires sensor datasheet...journal article 2024
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Martin, H.A. (author), Xu, Haojia (author), Smits, Edsger C.P. (author), van Driel, W.D. (author), Zhang, Kouchi (author)This study introduces a training protocol utilizing Convolutional Neural Networks (CNNs) and Confocal Scanning Acoustic Microscopy (CSAM) imaging techniques to classify Power Quad Flat No-leads (PQFN) package delamination. The investigation involves empty PQFN packages with varied substrate metallizations subjected to thermal cycling. Four...conference paper 2024
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Inamdar, A.S. (author), Hauck, Torsten (author), van Soestbergen, Michiel (author), van Driel, W.D. (author), Zhang, Kouchi (author)Model order reduction techniques are developed and utilized to make numerical simulations more efficient. The use of Reduce Order Models (ROM) also enables data exchange with external parties without disclosing the sensitive information present in a Full-Order Model (FOM). It is crucial to optimize for both the efficiency and accuracy of a ROM...conference paper 2024
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Inamdar, A.S. (author), van Soestbergen, M. (author), Mavinkurve, A. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Semiconductor devices are commonly encapsulated with Epoxy-based Moulding Compounds (EMC) to form an electronic package. EMC typically occupies a large volume within a package, and thus, governs its thermomechanical behaviour. When exposed to high temperatures (150°C and above), electronic packages predominantly show oxidation of the outer layer...journal article 2024
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Li, J. (author), Vollebregt, S. (author), Zhang, Y. (author), Shekhar, A. (author), May, Alexander (author), van Driel, W.D. (author), Zhang, Kouchi (author)Due to the deficient passivation of the interface between silicon carbide and silicon dioxide, the defect-induced capture and release of trapped charges triggered by external Bias Temperature Stress (BTS) leads to parameter shifts and degraded device performance. This study models the trap-induced transient current in silicon carbide metal-oxide...conference paper 2024
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Yuan, Cadmus (author), de Jong, S.D.M. (author), van Driel, W.D. (author)The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power packages, and large-die packaging. Against this backdrop, machine learning technologies emerge as dynamic tools for correlation building and classification, revolutionizing the...conference paper 2024
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Hu, X. (author), Huang, Jianlin (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...conference paper 2024
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de Jong, S.D.M. (author), Ghorbani Ghezeljehmeidan, A. (author), van Driel, W.D. (author)The ability to accurately predict the reliability and lifetime of electronics is of great importance to the industry. The failure of the solder joint is of particular interest for these predictions, because of their susceptibility to failure under thermo-mechanical stress. However, the experimental or even conventional simulation techniques...conference paper 2024
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Inamdar, A.S. (author), van Soestbergen, Michiel (author), Mavinkurve, Amar (author), van Driel, W.D. (author), Zhang, Kouchi (author)Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical...conference paper 2023
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Koch, Rouven (author), van Driel, D. (author), Bordin, A. (author), Lado, Jose L. (author), Greplová, E. (author)Determining Hamiltonian parameters from noisy experimental measurements is a key task for the control of experimental quantum systems. An interesting experimental platform where precise knowledge of device parameters is useful is the quantum-dot-based Kitaev chain. In these systems, the fine tuning of Hamiltonian parameters is crucial in...journal article 2023
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Bordin, A. (author), Wang, Guanzhong (author), Liu, Chun Xiao (author), ten Haaf, S.L.D. (author), van Loo, N. (author), Mazur, G.P. (author), Xu, D. (author), van Driel, D. (author), Zatelli, F. (author), Gazibegovic, Sasa (author), Badawy, Ghada (author), Bakkers, Erik P.A.M. (author), Wimmer, M.T. (author), Kouwenhoven, Leo P. (author), Dvir, T. (author)A short superconducting segment can couple attached quantum dots via elastic cotunneling (ECT) and crossed Andreev reflection (CAR). Such coupled quantum dots can host Majorana bound states provided that the ratio between CAR and ECT can be controlled. Metallic superconductors have so far been shown to mediate such tunneling phenomena, albeit...journal article 2023
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van Driel, D. (author), Wang, Guanzhong (author), Bordin, A. (author), van Loo, N. (author), Zatelli, F. (author), Mazur, G.P. (author), Xu, D. (author), Gazibegovic, Sasa (author), Badawy, Ghada (author), Bakkers, Erik P.A.M. (author), Kouwenhoven, Leo P. (author), Dvir, T. (author)Semiconductor nanowires coupled to superconductors can host Andreev bound states with distinct spin and parity, including a spin-zero state with an even number of electrons and a spin-1/2 state with odd-parity. Considering the difference in spin of the even and odd states, spin-filtered measurements can reveal the underlying ground state. To...journal article 2023
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Yazdan Mehr, M. (author), Hajipour, Pejman (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Cooremans, Thierry (author), De Buyl, Francois (author), Zhang, Kouchi (author)Adhesive bonding is a key joining technology in many industrial applications, including automotive, aerospace industries, biomedical devices, and microelectronic components. Adhesive bonding is gaining more and more attention due to the increasing demand for joining similar or dissimilar components, mostly within the framework of designing...conference paper 2023
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van Loo, N. (author), Mazur, G.P. (author), Dvir, T. (author), Wang, Guanzhong (author), Dekker, R.C. (author), Lemang, M.F. (author), Sfiligoj, C. (author), Bordin, A. (author), van Driel, D. (author), Kouwenhoven, Leo P. (author)The proximity effect in semiconductor-superconductor nanowires is expected to generate an induced gap in the semiconductor. The magnitude of this induced gap, together with the semiconductor properties like spin-orbit coupling and g-factor, depends on the coupling between the materials. It is predicted that this coupling can be adjusted...journal article 2023
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Martin, H.A. (author), Reintjes, Marcia (author), Reijs, Dave (author), Dorrestein, Sander (author), Kengen, Martien (author), Libon, Sebastien (author), Smits, Edsger (author), Tang, Xiao (author), Koelink, Marco (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spreading applications. However, growing diamond films to the...conference paper 2023