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Tang, Zhuorui (author), Zhao, Shibo (author), Li, Jian (author), Zuo, Yuanhui (author), Tian, Jing (author), Tang, Hongyu (author), Fan, J. (author), Zhang, Kouchi (author)This work addresses a novel technique for selecting the best process parameters for the 4H–SiC epitaxial layer in a horizontal hot-wall chemical vapor reactor using a transient multi-physical (thermal-fluid-chemical) simulation model and combined with a machine-learning model. An experiment was performed to validate the feasibility of the...journal article 2024
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Li, Wenyu (author), Chen, Wei (author), Jiang, Jing (author), Tang, H. (author), Fan, J. (author)Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductance and thermal resistance. Besides, the temperature at each point...journal article 2023