Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints

To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and...

Lumen Degradation Lifetime Prediction for High-Power White LEDs Based on the Gamma Process Model

Nowadays, due to the advancement of design and manufacturing technology, there are many consumer products with high reliability. Similarly, the competition in the business sector influences the product development time to become shorter and that makes it difficult for manufacturers to evaluate the reliability of current products before new...