Complicating the debate: Evaluating the potential of gas-chromatography-mass spectrometry for differentiating prehistoric aceramic tar production techniques

Birch bark tar was used extensively throughout human history. While later ceramic-based production technologies are known, prehistoric aceramic techniques leave little to no archaeological evidence. Experimental tar production attempts to fill this gap and suggest potential techniques. However, their archaeological relevance is unclear....

Traditional adhesive production systems in Zambia and their archaeological implications

This study explores traditional adhesives using an ethnobiological approach within a multisocioecological context in Zambia. Through semi-structured interviews, videotaped demonstrations, and herbarium collections, we investigated the traditional adhesives people know and use, the flexibility of production processes, resource usage, and...

Testing non-destructive spectrometric methods for the identification and distinction of archaeological pine wood tar and birch bark tar

Archaeological findings prove the appearance and use of birch bark tar since the Middle Palaeolithic. The production and use of birch bark tar and pine wood tar has overlapped since at least the late Neolithic, but probably for much longer. The reliable chemical identification of such archaeological tar residues can offer valuable insights...

A multi-analytical approach reveals flexible compound adhesive technology at Steenbokfontein Cave, Western Cape

Evidence of different compound resin-based adhesives is present in South Africa from at least 77000 years ago. Ancient glue production is considered one of the oldest known highly complex technologies, requiring advanced technological and mental abilities. However, our current knowledge of adhesive materials, recipes, and uses in South Africa is...

Fracture and Failure of Adhesives

This article presents an overview of methods for analyzing the facture and failure of adhesives. Special attention is given to stress analysis in adhesive bonds, as the difficulty of performing an accurate stress analysis is a major limitation of many failure analysis methods. The article also covers the effect of manufacturing and...

Influence of cyclic aging on adhesive mode mixity in dissimilar composite/metal double cantilever beam joints

The adhesive layer in the adhesive joints can experience different modes of loading. Although the fracture energy of adhesive is generally considered to be a material parameter, it is found to be a function of the joint configuration too. Thus, to accurately simulate the behaviour of bonded joints, it is recommended to obtain the fracture...

Testing mechanical performance of adhesively bonded composite joints in engineering applications: an overview

The development of new adhesives has allowed to expand the application of bonding into the most diverse industrial fields. This review article presents the commonly used experimental methods for the investigation of mechanical performance of adhesively bonded joints in the aerospace, wind energy, automotive and civil engineering sectors. In...

Effect of surface roughness and chemistry on the adhesion and durability of a steel-epoxy adhesive interface

This work focuses on the effect of surface roughness and surface chemistry on the initial adhesion strength and corrosive de-adhesion properties of adhesive bonds. The adherend used in this study is a S690 low-alloy steel whereas the adhesive is a 2-component epoxy-amine adhesive (Araldite 2015). The steel surface is subjected to different...

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Interfacial properties of Cu/SiO₂ in semiconductor devices has been a challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO₂. The...

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...

Experimental and numerical analysis of thick embedded laminated glass connections

Laminated glass components are usually realized by bonding glass plates using interlayer polymers that develop adhesion forces during lamination. Recently, these adhesion forces have been used also to realize special adhesive connections for structural glass components and assemblies. The typical example of such a joining technique is...

Laboratory strength testing of pine wood and birch bark adhesives: a first study of the material properties of pitch

Adhesives are an important yet often overlooked aspect of human tool use. Previous experiments have shown that compound resin/gum adhesive production by anatomically modern humans was a cognitively demanding task that required advanced use of fire, forward planning, and abstraction among other traits. Yet the oldest known adhesives were produced...

Influence of environmental ageing and displacement rate on crack resistance of adhesives, as determined on adhesive bonded TDCB-specimens

Fracture toughness measurements were carried out to test the ageing behaviour of three adhesives in different environments. It was possible to compare and evaluate adhesives and surface pretreatments. It is doubtful whether the derived R-curves could be used for residual strength calculations in certain environments. Phosphoric acid anodizing...