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Lei, Shunbo (author), Zhang, Yichen (author), Shahidehpour, Mohammad (author), Hou, Yunhe (author), Panteli, Mathaios (author), Chen, Xia (author), Aydin, N.Y. (author), Liang, Liang (author), Wang, Cheng (author), Wang, Chong (author), She, Buxin (author)The switch to renewable power generation is promoted aggressively by government policies, growing investments, consumer preferences, and many other factors. However, high renewable penetration can impose significant challenges to designing and employing measures that enhance power grid resilience. Resilience has been posed as a requirement of...contribution to periodical 2024
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Chen, Jiaqi (author), Dan, Hancheng (author), Ding, Yongjie (author), Gao, Y. (author), Guo, Meng (author), Guo, Shuaicheng (author), Han, Bingye (author), Hong, Bin (author), Hou, Yue (author), Hu, Chichun (author), Hu, Jing (author), Huyan, Ju (author), Jiang, Jiwang (author), Jiang, Wei (author), Li, Cheng (author), Liu, Pengfei (author), Liu, Yu (author), Liu, Zhuangzhuang (author), Lu, Guoyang (author), Ouyang, Jian (author), Qu, Xin (author), Ren, Dongya (author), Wang, Chao (author), Wang, Chaohui (author), Wang, Dawei (author), Wang, Di (author), Wang, Hainian (author), Wang, Haopeng (author), Xiao, Yue (author), Xing, Chao (author), Xu, Huining (author), Yan, Yu (author), Yang, Xu (author), You, Lingyun (author), You, Zhanping (author), Yu, Bin (author), Yu, Huayang (author), Yu, Huanan (author), Zhang, Henglong (author), Zhang, Jizhe (author), Zhou, Changhong (author), Zhou, Changjun (author), Zhu, Xingyi (author)Sustainable and resilient pavement infrastructure is critical for current economic and environmental challenges. In the past 10 years, the pavement infrastructure strongly supports the rapid development of the global social economy. New theories, new methods, new technologies and new materials related to pavement engineering are emerging....review 2021
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Hou, F. (author), Wang, Qidong (author), Chen, Min (author), Zhang, Kouchi (author), Ferreira, Jan Abraham (author), Wang, Wenbo (author), Ma, R. (author), Su, Meiying (author), Song, Yang (author)In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermo-mechanical co-design was conducted, and the maximum package parasitic inductance was found to be about 1.24 nH at 100...journal article 2020