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Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition
High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging
Spatial-temporal potential exposure risk analytics and urban sustainability impacts related to COVID-19 mitigation: A perspective from car mobility behaviour
Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints
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