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He, S. (author), Chen, Y. (author), Liang, M. (author), Yang, En-Hua (author), Schlangen, E. (author)
This study investigates the microstructural changes of cement paste due to the inclusion of polymeric microfiber at different water-to-cement (w/c) ratios. A procedure to quantify the porosity of epoxy impregnated interfacial transition zone (ITZ) is also presented. Results show that the microstructures of the ITZ beneath and above a...
journal article 2023
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Ji, X. (author), Du, L. (author), He, S. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
Copper nanoparticles (CuNPs) sintering for flip-chip interconnects is a promising solution for 3D and heterogeneous integration to overcome the limitation of solder materials. To this end, we perform the photolithographic stencil printing method to pattern CuNPs, and the form of flip-chip interconnects is completed after CuNPs sintering...
journal article 2023