Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation

Road performance evaluation of prestressed high-strength concrete pile waste powder as alternative filler in asphalt concrete

Exploring the Utilization of PHC Pile Waste Concrete as Filler in Asphalt Mastics

Effects of GBFS content and curing methods on the working performance and microstructure of ternary geopolymers based on high-content steel slag

Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Extrinsic self-healing asphalt materials: A mini review

Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Spatial-temporal potential exposure risk analytics and urban sustainability impacts related to COVID-19 mitigation: A perspective from car mobility behaviour

Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints