Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Short Circuits of a 10 MW High Temperature Superconducting Wind Turbine Generator

Direct drive high temperature superconducting (HTS) wind turbine generators have been proposed to tackle challenges for ever increasing wind turbine ratings. Due to smaller reactances in HTS generators, higher fault currents and larger transient torques could occur if sudden short circuits happen at generator terminals. In this paper, a finite...