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Ji, Y. (author), Fu, Xiaoqian (author), Ding, Feng (author), Xu, Yongtao (author), He, Yang (author), Ao, Min (author), Xiao, Fulai (author), Chen, Dihao (author), Dey, P. (author), Qin, Wentao (author), Xiao, Kui (author), Ren, Jingli (author), Kong, Decheng (author), Li, Xiaogang (author), Dong, Chaofang (author)
Efficiently designing lightweight alloys with combined high corrosion resistance and mechanical properties remains an enduring topic in materials engineering. Due to the inadequate accuracy of conventional stress-strain machine learning (ML) models caused by corrosion factors, a novel reinforcement self-learning ML algorithm combined with...
journal article 2024
document
Xie, Weiming (author), Sun, J. (author), Guo, Leicheng (author), Xu, Fan (author), Wang, Xianye (author), Ji, Hongyu (author), Fan, Yaoshen (author), Wang, Zhengbing (author), He, Qing (author)
Coastal tidal flats provide valuable ecosystems, but are highly sensitive to tidal dynamics, sea-level rise, and human activities. Tidal inundation depth and frequency are known to affect tidal flat morphodynamics. However, the causes, processes and extent remain uncertain, particularly given the associated changes in sediment availability. In...
journal article 2023
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Ji, X. (author), van Zeijl, H.W. (author), Jiao, Weiping (author), He, S. (author), Du, L. (author), Zhang, Kouchi (author)
The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...
conference paper 2023
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Ji, X. (author), Du, L. (author), He, S. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
Copper nanoparticles (CuNPs) sintering for flip-chip interconnects is a promising solution for 3D and heterogeneous integration to overcome the limitation of solder materials. To this end, we perform the photolithographic stencil printing method to pattern CuNPs, and the form of flip-chip interconnects is completed after CuNPs sintering...
journal article 2023
document
Ji, Yanjie (author), Ma, Xinwei (author), He, Mingjia (author), Jin, Yuchuan (author), Yuan, Y. (author)
Bike-sharing systems have rapidly expanded around the world. Previous studies found that docked and dockless bike-sharing systems are different in terms of user demand and travel characteristics. However, their usage regularity and its determinants have not been fully understood. This research aims to fill this gap by exploring smart card...
journal article 2020
document
Yin, L.J. (author), Ji, Wei Wei (author), Liu, Shi Yu (author), He, Wei Dong (author), Zhao, Lin (author), Xu, Xin (author), Fabre, A. (author), Dierre, B.F.P.R. (author), Lee, Ming Hsien (author), van Ommen, J.R. (author), Hintzen, H.T.J.M. (author)
Synthesizing pure phase Ba<sub>3</sub>Si<sub>6</sub>O<sub>9</sub>N<sub>4</sub> by the conventional solid-state reaction method is challenging because of easily formed secondary phase Ba<sub>3</sub>Si<sub>6</sub>O<sub>12</sub>N<sub>2</sub> showing similar crystal structure. In this work, an alternative low temperature synthesis method is...
journal article 2016
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