Munirathinam, B. (author), van Dam, J.P.B. (author), Herrmann, Annemarie (author), van Driel, W.D. (author), De Buyl, F. (author), Erich, S. J.F. (author), van der Ven, L.G.J. (author), Adan, O. C.G. (author), Mol, J.M.C. (author) In general, packaging materials which encapsulate light emitting diodes (LEDs) and microelectronic devices offer barrier protection against several environmental hazards such as water and ionic contaminants. However, these encapsulants may provide pathways for water and ionic contaminants to reach the metal/polymer interfaces and provoke local...
journal article 2021
