Searched for: author%253A%2522Mol%252C%2520J.M.C.%2522
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Herrmann, A. (author), Erich, S. J.F. (author), van der Ven, L. G.J. (author), Huinink, H. P. (author), van Driel, W.D. (author), van Soestbergen, M. (author), Mavinkurve, A. (author), De Buyl, F. (author), Fischer, H. R. (author), Mol, J.M.C. (author), Adan, O. C.G. (author)
Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influences, with one of these influences being moisture ingress, causing corrosion. To obtain the needed thermal and mechanical properties EMCs require a high loading of (silica) fillers, introducing a large amount of interface. While silane coupling...
journal article 2022
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Munirathinam, B. (author), van Dam, J.P.B. (author), Herrmann, Annemarie (author), van Driel, W.D. (author), De Buyl, F. (author), Erich, S. J.F. (author), van der Ven, L.G.J. (author), Adan, O. C.G. (author), Mol, J.M.C. (author)
In general, packaging materials which encapsulate light emitting diodes (LEDs) and microelectronic devices offer barrier protection against several environmental hazards such as water and ionic contaminants. However, these encapsulants may provide pathways for water and ionic contaminants to reach the metal/polymer interfaces and provoke local...
journal article 2021
document
Herrmann, A. (author), Erich, S. J.F. (author), van der Ven, L.G.J. (author), Huinink, H.P. (author), van Driel, W.D. (author), van Soestbergen, M (author), Mavinkurve, A (author), De Buyl, Francois (author), Mol, J.M.C. (author), Adan, O. C.G. (author)
The reliability of LEDs decreases in moist environments. One potential gateway of moisture ingress, reducing the product lifetime is the lens. In white LEDs, phosphor particles are embedded into the optical silicone of the lens to convert the blue light emitted by the diode down in frequency and achieve a light output that appears white. In this...
journal article 2020