Localised aqueous corrosion of electroless nickel immersion gold-coated copper

Electroless nickel (Ni) immersion gold (Au), commonly referred to by the acronym ENIG, is the most common protective coating applied on the exposed copper (Cu) traces of printed circuit boards (PCBs). In this work, we elucidate the local corrosion mechanism of the ENIG-Cu system by applying microscopic, surface analysis and electrochemical...

In-situ study of corrosion of commercial SD memory card by local electrochemical techniques

In-situ study of corrosion phenomena on electronic devices by local electrochemical techniques