Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductance and thermal resistance. Besides, the temperature at each point...

Room temperature ppt-level NO₂ gas sensor based on SnO _x/SnS nanostructures with rich oxygen vacancies

In this paper, tin oxidation (SnO x )/tin-sulfide (SnS) heterostructures are synthesized by the post-oxidation of liquid-phase exfoliated SnS nanosheets in air. We comparatively analyzed the NO2 gas response of samples with different oxidation levels to study the gas sensing mechanisms. The results show that the samples oxidized at 325 °C are...

Effects of Defect and Temperature on the Mechanical Performance of WS₂: A Multiscale Analysis

This paper analyzes the mechanical properties of tungsten disulfide (WS2) by means of multiscale simulation, including density functional theory (DFT), molecular dynamic (MD) analysis, and finite element analysis (FEA). We first conducted MD analysis to calculate the mechanical properties (i.e., Young's modulus and critical stress) of WS2....

Effect of Nano-SnS and Nano-MoS₂ on the corrosion protection performance of the polyvinylbutyral and zinc-rich polyvinylbutyral coatings

In this paper, four composite coatings of nano-SnS/polyvinylbutyral (PVB), nano-MoS₂/PVB, nano-SnS-Zn/PVB, and nano-MoS₂-Zn/PVB were prepared, and their anti-corrosion mechanism was analyzed by experimental and theoretical calculations. The results of the electrochemical experiments show that the effect of nano-MoS<sub>2...

Thermal Management on IGBT Power Electronic Devices and Modules

As an increasing attention towards sustainable development of energy and environment, the power electronics (PEs) are gaining more and more attraction on various energy systems. The insulated gate bipolar transistor (IGBT), as one of the PEs with numerous advantages and potentials for development of higher voltage and current ratings, has been...

Germanene on single-layer ZnSe substrate: Novel electronic and optical properties

In this work, the structural, electronic and optical properties of germanene and ZnSe substrate nanocomposites have been investigated using first-principles calculations. We found that the large direct-gap ZnSe semiconductors and zero-gap germanene form a typical orbital hybridization heterostructure with a strong binding energy, which shows...

Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...

Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study

The sensing behavior of monolayer tin sulfide (SnS) for four gas molecules (NH₃, NO₂, CO, and H₂O) are studied by the first-principle calculation based on density-functional theory. We calculate adsorption energy, adsorption distance, and Hirshfeld charge to estimate the adsorption ability of monolayer SnS for...

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component

The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the...