3D interconnect technology based on low temperature copper nanoparticle sintering

We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...

Multi-GNSS PPP-RTK: Mixed-receiver network and user scenarios

In this contribution, we present full-rank observation equations of the network and user receivers, of mixed types, through an application of S-system theory. We discuss the important roles played by the inter system biases (ISBs), and we show how the three-component structure of PPP-RTK is affected by the inclusion of the ISBs as extra...

MEMS enabled fast time-resolved X-ray diffraction characterization platform for copper nanoparticle sintering in heterogeneous integration applications

We report the design, fabrication and experimental investigation of a MEMS micro-hotplate (MHP) for fast time-resolved X-ray diffraction (TRXRD) study of Cu nanoparticle paste (nanoCu paste) sintering process. The device and its system are designed to have a 60 ms minimum time interval, uniform temperature distribution and variant gas...