Near-infrared light-driven asymmetric photolytic reduction of ketone using inorganic-enzyme hybrid biocatalyst

Effective photolytic regeneration of the NAD(P)H cofactor in enzymatic reductions is an important and elusive goal in biocatalysis. It can, in principle, be achieved using a near-infrared light (NIR) driven artificial photosynthesis system employing H₂O as the sacrificial reductant. To this end we utilized TiO₂/reduced...

Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures

With the increased deployment of power modules in demanding conditions, sintering materials, especially composite sintering materials, have raised growing interest due to their cost-effectiveness and suitability. Therefore, this study explores the viability of Cu–Ag composite sintering material, focusing on solvent influence through...

Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer

Micro LED displays offer superior performance compared to traditional LCD and OLED displays. However, challenges in transfer technology, such as high throughput and scalability, must be addressed. Among various mass transfer techniques, stamp transfer and laser-assisted transfer are widely used for Micro LED assembly. The laser-assisted transfer...

Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications

With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost...

Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore

Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H₂S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...

Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging

With the development of electronic technology towards high power, miniaturization, and system integration, power electronic packaging is facing increasing challenges, especially for die attachment. This research aims to explore silver-coated copper (Cu@Ag) paste with sufficient mechanical properties and high-temperature reliability, as an...

Changes in glacier albedo and the driving factors in the Western Nyainqentanglha Mountains from 2001 to 2020

Glacier surface albedo dominates glacier energy balance, thus strongly affecting the glacier mass balance. Glaciers in the Western Nyainqentanglha Mountains (WNM) experienced large mass losses in the past two decades, but long-term changes of glacier albedo and its drivers are less understood. In this study, we retrieved glacier albedo with...

Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging

Ultrasonic wedge bonding of aluminum (Al) wires is a widely applied interconnect technology for power electronic packaging. The joint quality of the wedge bonding is mainly affected by the process parameters and material properties. Inappropriate process parameters will lead to failure modes such as chip surface pit, metal layer peeling off,...

Review of Laser Sintering of Nanosilver Pastes for Die Attachment: Technologies and Trends

Nanosilver pastes have been regarded as the most promising die-attach materials for high-temperature and high-power applications due to their advantages such as excellent thermal conductivity, electrical conductivity, high temperature resistance, and good shear strength. However, the common hot pressing sintering process for nanosilver pastes...

An Alternative Micro LED Mass Transfer Technology: Self-Assembly

Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits...

Finite Element Modeling for Thermal Conductivity of Cement-based Encapsulation Materials

With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation...

Misinformation Detection on Social Media: Challenges and the Road Ahead

It is increasingly challenging to deal with the volume,variety, velocity, and veracity of misinformation (e.g., dissemination of fake news contents, spurious posts, and fabricated images/videos) from different online platforms. In this article, we present an overview of existing machine learning and information hiding-based misinformation...

Visualizing Dynamic Changes During TGF-β-Induced Epithelial to Mesenchymal Transition

Epithelial to mesenchymal transition (EMT) is crucial during embryonic development, tissue fibrosis, and cancer progression. Epithelial cells that display a cobblestone-like morphology can undergo a switch to mesenchymal-like phenotype, displaying an elongated spindle shape or a fibroblast-like morphology. EMT is characterized by timely and...

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces the stress damage caused by the pressure to the chip, improves reliability, and is widely applied in manufacturing....

Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications

With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...

Glacier area and snow cover changes in the range system surrounding tarim from 2000 to 2020 using google earth engine

Glacier and snow are sensitive indicators of regional climate variability. In the early 21st century, glaciers in the West Kunlun and Pamir regions showed stable or even slightly positive mass budgets, and this is anomalous in a worldwide context of glacier recession. We studied the evolution of snow cover to understand whether it could...

Interannual and seasonal variability of glacier surface velocity in the parlung zangbo basin, tibetan plateau

Monitoring glacier flow is vital to understand the response of mountain glaciers to environmental forcing in the context of global climate change. Seasonal and interannual variability of surface velocity in the temperate glaciers of the Parlung Zangbo Basin (PZB) has attracted significant attention. Detailed patterns in glacier surface...

Glacier mass balance in the Nyainqentanglha mountains between 2000 and 2017 retrieved from ZiYuan-3 stereo images and the SRTM DEM

Mountain glaciers are excellent indicators of climate change and have an important role in the terrestrial water cycle and food security in many parts of the world. Glaciers are the major water source of rivers and lakes in the Nyainqentanglha Mountains (NM) region, where the glacier area has the second largest extent on the Tibetan Plateau....