Enhancing luminous flux and color rendering of laser-excited YAG:Ce³⁺ single crystal phosphor plate via surface roughening and low-temperature sintering a CaAlSiN₃:Eu²⁺ phosphor-in-borate glass

Y₃Al₅O₁₂:Ce³⁺ (YAG:Ce³⁺) single crystal phosphor (SCP) exhibits high internal quantum efficiency (IQE) and excellent thermal conductivity and stability. Such properties are promising in high-power laser-excited white lighting applications. However, YAG:Ce³⁺ SCP usually shows...

Sulfur-Rich Ageing Mechanism of Silicone Encapsulant Used in LED Packaging: An Experimental and Molecular Dynamic Simulation Study

In a light-emitting diode (LED) package, silicone encapsulant serves as a chip protector and enables the light to transmit, since it exhibits the advantages of high light transmittance, high refractive index, and high thermal stability. However, its reliability is still challenged under harsh operation conditions. In this study, the optical...

Luminous performances characterization of YAG: Ce3+ phosphor/silicone composites using both reflective and transmissive laser excitations

YAG: Ce3+ phosphor/silicone composites are widely used in solid-state lighting as a light converter to achieve white lighting. However, because of high thermal resistance and low thermal stability, the luminous performance of YAG: Ce3+ phosphor/silicone composite deteriorates rapidly when excited by high-power-density blue-laser. To explore...

基于Lambert-Beer理论与人工神经网络的混合荧光粉发射光谱预测

The emission spectra of high color rendering phosphors, mixed with the yttrium aluminium garnet, silicon based oxynitride and nitride based phosphors, were predicted by the Lambert-Beer theory and back propagation neural network (BP NN). Firstly, the modified Lambert-Beer model was used to calculate the proportional coefficient of the...

Prognostics of radiation power degradation lifetime for ultraviolet light-emitting diodes using stochastic data-driven models

With their advantages of high efficiency, long lifetime, compact size and being free of mercury, ultraviolet light-emitting diodes (UV LEDs) are widely applied in disinfection and purification, photolithography, curing and biomedical devices. However, it is challenging to assess the reliability of UV LEDs based on the traditional life test or...

Review of Packaging Schemes for Power Module

SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance...

Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm²Heat Dissipation

In this article, a microchannel thermal management system (MTMS) with the two-phase flow using the refrigerant R1234yf with low global warming potential is presented. The thermal test vehicles (TTVs) were made of either single or multiple thermal test chips embedded in the substrates, which were then attached to the MTMS. The system included...

Characterization of PCB Embedded Package Materials for SiC MOSFETs

In this paper, a novel fan-out panel-level printed circuit board (PCB) embedded package technology for silicon carbide (SiC) MOSFET power module is presented to address parasitic inductances, heat dissipation, and reliability issues that are inherent with aluminum wires used in conventional packaging scheme. To withstand high temperature...