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Searched for: collection%253Air
(1 - 7 of 7)
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Multi Physics Simulation of Wafer Bonding with Nano Copper Paste
Warpage deformation analysis of AMB ceramic substrates in power modules
Estimation of Facial Contact Pressure Based on Finite Element Analysis
Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
Development of an andvanced fe-numerical method for virtual grading of timber
Thermal Expansion and Aging Effects in Neuromorphic Signal Processor
Short Circuits of a 10 MW High Temperature Superconducting Wind Turbine Generator
Searched for: collection%253Air
(1 - 7 of 7)
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