- Effects of natural and thermal oxidation on electronic and optical properties of monolayer WS2: a theoretical study
- Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
- Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation
- Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm
- A Class-D Piezoelectric Speaker Driver Using A Quadrature Feedback Chopping Scheme achieving 29dB Large-Signal THD+N Improvement
- Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study
- Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
- Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
- Temperature Field Simulation and optimization for Horizontal 6-inch 4H-SiC Epitaxial CVD Reactor by Induction Heating
- 23.3 A 51A Hybrid Magnetic Current Sensor with a Dual Differential DC Servo Loop and 43mArmsResolution in a 5MHz Bandwidth
- Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition